Wafer Edge Profiling Grinder from China
A wafer edge profiling grinder creates rounded wafer edges to prevent chipping during handling and processing. It is classified under tariff item 8474.80.00 as grinding machinery for semiconductor mineral wafers.
Duty Rate — China → Canada
0%
Import Tips
• Document that the grinder is for semiconductor wafers, not metal, to support classification under 8474.80.00
• Provide the CBSA with the machine's specifications showing it handles brittle materials
• Consider whether the equipment qualifies for duty-free entry under the Information Technology Agreement (ITA)