Silicon Wafer Lapping Machine from United States
A silicon wafer lapping machine abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. It is classified under tariff item 8474.80.00 as grinding or lapping machinery for solid mineral wafers.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the machine is described as lapping semiconductor wafers, not metal, to avoid classification under Chapter 84.60
• Provide the CBSA with the machine's operational specifications showing it handles brittle materials
• Verify if the equipment qualifies for duty relief under the Machinery Remission Program