Silicon Wafer Lapping Machine from Germany
A silicon wafer lapping machine abrasively removes material from wafer surfaces to achieve precise flatness and thickness uniformity for semiconductor fabrication. It is classified under tariff item 8474.80.00 as grinding or lapping machinery for solid mineral wafers.
Duty Rate — Germany → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8474800030; Equal To 8474800090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the machine is described as lapping semiconductor wafers, not metal, to avoid classification under Chapter 84.60
• Provide the CBSA with the machine's operational specifications showing it handles brittle materials
• Verify if the equipment qualifies for duty relief under the Machinery Remission Program