Semiconductor Wafer Slicing Saw from Germany
A semiconductor wafer slicing saw is a high-precision inner-diameter saw that cuts ultra-thin wafers from monocrystalline semiconductor boules while minimizing material damage. It falls under tariff item 8474.80.00 as slicing machinery for solid mineral substances.
Duty Rate — Germany → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8474800030; Equal To 8474800090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Document that the saw is for slicing semiconductor boules, not metal, to avoid reclassification under Chapter 84.61
• Provide the CBSA with the machine's specifications showing it handles brittle materials
• Consider whether the saw qualifies for duty relief under the Machinery Remission Program