Semiconductor Wafer Slicing Saw from Germany
A semiconductor wafer slicing saw is a high-precision inner-diameter saw that cuts ultra-thin wafers from monocrystalline semiconductor boules while minimizing material damage. It falls under tariff item 8474.80.00 as slicing machinery for solid mineral substances.
Duty Rate — Germany → Canada
0%
Import Tips
• Document that the saw is for slicing semiconductor boules, not metal, to avoid reclassification under Chapter 84.61
• Provide the CBSA with the machine's specifications showing it handles brittle materials
• Consider whether the saw qualifies for duty relief under the Machinery Remission Program