Gallium Arsenide Wafer Grinder from United States
A gallium arsenide wafer grinder is a specialized machine for back-thinning compound semiconductor wafers to precise thicknesses for optoelectronic applications. It is classified under tariff item 8474.80.00 as grinding machinery for solid mineral semiconductor substances.
Duty Rate — United States → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8474800030; Equal To 8474800090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Clearly document that the grinder is for semiconductor wafers, not general metalworking, to avoid classification under Chapter 84.61
• Keep records of the machine's specifications to show it handles brittle mineral materials
• Consider whether the equipment qualifies for a duty deferral under the Customs Duty Deferral Program