Diamond Wire Wafer Slicer from United States
A diamond wire wafer slicer uses diamond-impregnated wires to cut hundreds of ultra-thin wafers from silicon boules in a single pass, reducing material loss compared to traditional saws. It is classified under tariff item 8474.80.00 as machinery for slicing solid mineral substances, specifically semiconductor materials.
Duty Rate — United States → Canada
PGA flags (1)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8474800030; Equal To 8474800090. Logic: MATCH IF (Valid HS Code).
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the machine is described as slicing solid mineral substances, not as a machine tool of Chapter 84.56, to avoid reclassification
• Have technical documentation ready to show the CBSA that the primary function is slicing silicon boules
• Verify whether the equipment qualifies for duty relief under the Machinery Remission Program