Diamond Wire Wafer Slicer from Mexico
A diamond wire wafer slicer uses diamond-impregnated wires to cut hundreds of ultra-thin wafers from silicon boules in a single pass, reducing material loss compared to traditional saws. It is classified under tariff item 8474.80.00 as machinery for slicing solid mineral substances, specifically semiconductor materials.
Duty Rate — Mexico → Canada
0%
Import Tips
• Ensure the machine is described as slicing solid mineral substances, not as a machine tool of Chapter 84.56, to avoid reclassification
• Have technical documentation ready to show the CBSA that the primary function is slicing silicon boules
• Verify whether the equipment qualifies for duty relief under the Machinery Remission Program