Diamond Wafer Grinding Machine from Japan
A high-precision grinder using diamond abrasives for initial silicon wafer backgrinding, reducing wafer thickness from 700μm to less than 100μm. It grinds solid mineral wafers, fitting the scope of grinding machines for mineral substances.
Duty Rate — Japan → Canada
0%
Import Tips
• Confirm the machine is not a machine-tool for working materials by cutting or abrading, which would fall under heading 84.60
• Provide evidence that the primary function is grinding wafers as mineral substances
• Verify if the machine qualifies for duty-free treatment under the Information Technology Agreement