Crystal Ingot Slicing Pre-Grinder from Japan
A pre-grinding machine that prepares silicon ingots before multi-wire saw slicing into wafers. It ensures uniform slicing and higher wafer quality by grinding the solid mineral ingot, fitting the definition of a grinding machine for mineral substances.
Duty Rate — Japan → Canada
0%
Import Tips
• Document that the machine's principal function is grinding silicon ingots, not slicing or sawing
• Keep records of the machine's specifications to demonstrate it is not a machine-tool of heading 84.56
• Check if the equipment qualifies for reduced duty under the WTO Information Technology Agreement