Wafer Lapping Plate from China
A wafer lapping plate is a cast iron or ceramic plate used in wafer grinders and lappers to achieve ultra-flat surfaces on semiconductor wafers before fabrication. It is essential for ensuring wafer flatness and thickness uniformity. This plate is equally suitable for use with machines of headings 84.70 to 84.72, supporting wafer preparation for ADP systems.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the lapping plate is declared as a part of semiconductor processing equipment, not as a general abrasive article
• Provide specifications showing its principal use in wafer lapping machines
• Check if the plate qualifies for duty relief under Canada's programs for semiconductor manufacturing equipment