Wafer Grinder Diamond Wheel from Japan
A resin or metal-bonded diamond grinding wheel for back-grinding semiconductor wafers to precise thickness post-processing, dedicated to grinders of heading 84.72. It achieves flatness critical for device fabrication. This part is classified under tariff item 8473.40.00 as a part of heading 84.72 machines.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the diamond wheel is declared as a part of a wafer grinder of heading 84.72, not as a general abrasive tool
• If the wheel is presented as an abrasive article, it may be classified under heading 68.04
• Keep records of the specific grinder model it is designed for to support your declaration