Semiconductor Wafer Slicing Saw Blade from China
A diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of heading 84.72. It ensures minimal kerf loss and high precision. This part is classified under tariff item 8473.40.00 as a part of heading 84.72 machines.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the saw blade is declared as a part of a wafer slicing saw of heading 84.72, not as a general cutting tool
• If the blade is presented as an interchangeable tool, it may be classified under heading 82.07
• Keep documentation of the specific saw model it is designed for to support your declaration