Wafer Slicing Saw Servo Drive Printed Circuit Board from United States
This printed circuit assembly (PCA) controls precision servo motors in wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It ensures micron-level accuracy in blade positioning and feed rates. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify the PCA under 8473.30.20 as a printed circuit assembly for heading 84.71 machines
• Ensure the PCA is not a complete servo drive; if it includes a motor, it may be classified elsewhere
• Keep documentation of the PCA's use in slicing saws