Wafer Slicing Saw Controller Board from Germany
This is a specialized printed circuit assembly (PCA) that controls blade speed and coolant flow in diamond saws used to slice monocrystalline boules into semiconductor wafers. It is designed solely or principally for use with automatic data processing machines of heading 84.71, such as the controller systems in these saws. As a printed circuit assembly, it is classified under tariff item 8473.30.20, which covers such assemblies for machines of heading 84.71.
Duty Rate — Germany → Canada
Import Tips
• Ensure the board is declared as a printed circuit assembly under 8473.30.20, and be ready to provide technical documentation showing it is solely or principally for use with ADP machines of heading 84.71
• Verify whether the board qualifies for duty-free treatment under a free trade agreement, as rates may vary by origin
• If the board is imported with other components, confirm whether it should be classified separately or as part of a system under subheading 8471.49