Wafer Lapping Machine Pressure Control Board from Japan
This printed circuit assembly (PCA) regulates pneumatic pressure systems in wafer lapping machines, maintaining nanometer-level flatness tolerances for semiconductor wafer fabrication. It ensures uniform pressure distribution across wafer surfaces. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the PCA under 8473.30.20 as a printed circuit assembly for heading 84.71 machines
• Verify that the PCA is not a valve or pneumatic component excluded by Section XVI Note 1
• Keep records showing the PCA's role in lapping machine control