Wafer Lapping Machine Interface PCA from Japan
This printed circuit board assembly interfaces pressure sensors and motors in lapping equipment that achieves flatness tolerances for semiconductor wafers pre-polishing. It is a part principally for machines of heading 84.71. As such, it falls under tariff item 8473.30.20.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify this PCA under 8473.30.20 only if it is solely or principally used with lapping machines of heading 84.71
• Keep technical specifications to demonstrate its dedicated function
• Check if the goods are eligible for duty-free entry under a free trade agreement