Wafer Grinder Servo Drive PCA from United States
This printed circuit assembly provides servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It is a principal part of machines of heading 84.71. As such, it falls under tariff item 8473.30.20.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Classify this PCA under 8473.30.20 only if it is solely or principally used with wafer grinders of heading 84.71
• Provide technical documentation showing its function in servo control
• Verify if the goods are eligible for duty-free entry under a free trade agreement