Wafer Grinder Servo Drive PCA from China
This printed circuit assembly provides servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It is a principal part of machines of heading 84.71. As such, it falls under tariff item 8473.30.20.
Duty Rate — China → Canada
0%
Import Tips
• Classify this PCA under 8473.30.20 only if it is solely or principally used with wafer grinders of heading 84.71
• Provide technical documentation showing its function in servo control
• Verify if the goods are eligible for duty-free entry under a free trade agreement