Wafer Edge Grinder Vision PCA from United States
This printed circuit board processes machine vision edge profiles during semiconductor wafer edge grinding. It prevents chipping during handling. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.
Duty Rate — United States → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the PCA is principally used with wafer edge grinders of heading 84.71
• Keep records of the machine's classification to support the PCA's classification
• Check for any applicable duty relief programs for semiconductor manufacturing equipment