8473.30.20/Wafer Edge Grinder Vision PCA/Japan

Wafer Edge Grinder Vision PCA from Japan

This printed circuit board processes machine vision edge profiles during semiconductor wafer edge grinding. It prevents chipping during handling. As a part for machines of heading 84.71, it falls under tariff item 8473.30.20.

Duty Rate — Japan → Canada

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Import Tips

• Confirm the PCA is principally used with wafer edge grinders of heading 84.71

• Keep records of the machine's classification to support the PCA's classification

• Check for any applicable duty relief programs for semiconductor manufacturing equipment