Dicing Saw Laser Alignment Board from Japan
This printed circuit assembly processes laser alignment signals for wafer dicing saws cutting finished IC dice. It ensures scribe lane precision during the dicing process. As a dedicated part for machines of heading 84.71, it falls under tariff item 8473.30.20.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify this board under 8473.30.20 only if it is solely or principally used with dicing saws of heading 84.71
• Provide technical documentation showing its function in laser alignment
• Verify if the goods are eligible for duty-free entry under a free trade agreement