3DS Stacked 16GB HBM2 Memory Module from China
This 16GB High Bandwidth Memory 2 (HBM2) module uses 3D stacking technology for AI accelerators and high-performance workstations of heading 84.71. The advanced printed circuit assembly provides massive bandwidth for compute-intensive applications. As a PCA suitable for use solely or principally with machines of heading 84.71, it falls under tariff item 8473.30.20.
Duty Rate — China → Canada
0%
Import Tips
• Declare the HBM2 module under 8473.30.20 as a printed circuit assembly for heading 84.71 machines
• Verify that the module is not a complete memory unit classified under heading 85.23; if it is a storage device, it may be excluded
• Provide specifications showing the module's role in ADP machines