Wafer Lapping Machine from China
Automated lapping equipment that uses abrasive slurries to achieve flatness tolerances on semiconductor wafers prior to polishing. It prepares wafer surfaces for photolithography, classified here as other machinery for precision surface processing.
Duty Rate — China → Canada
0%
Import Tips
• Check if heading 84.86 applies for semiconductor manufacturing equipment
• Provide lapping process specifications and wafer flatness tolerances
• Verify if the machine requires any Canadian certification for industrial use