Multi-Wire Wafer Slicer from Japan
Diamond multi-wire saw for simultaneous slicing of hundreds of semiconductor wafers from a single boule, minimizing material waste. It is high-speed for production volumes, classified here as other cutting machinery for semiconductor materials.
Duty Rate — Japan → Canada
0%
PGA flags
No agency flag on this HTS number in the CBSA Single Window matching criteria.
CBSA Single Window matching criteria, unknown
Import Tips
• Consider heading 84.86 if the slicer is used in semiconductor manufacturing
• Provide documentation on the wire saw technology and wafer slicing process
• Ensure compliance with Canadian safety standards for high-speed machinery