Double-Sided Wafer Lapper from China
A machine for simultaneous lapping of both sides of semiconductor wafers using planetary motion carriers, achieving total thickness variation under 1 micron. It is essential for advanced semiconductor manufacturing, classified here as other machinery for soldering or welding-like precision surface processing.
Duty Rate — China → Canada
0%
Import Tips
• Classify as machinery for semiconductor manufacturing; consider whether heading 84.86 applies for machines used in semiconductor production
• Provide technical documentation showing the lapping process to justify the tariff item
• Check for end-use certificates if claiming preferential duty treatment