Pneumatic Wafer Grinding Spindle from Japan
A pneumatic-powered spindle assembly designed as a replaceable part for wafer grinders used in semiconductor manufacturing to achieve precise wafer thickness. It falls under tariff item 8467.99.00 as a part of a pneumatic hand tool.
Duty Rate — Japan → Canada
0%
Import Tips
• Document that the spindle is a part of a pneumatic hand tool, as CBSA may otherwise classify it as a machine tool part
• Provide technical specifications showing it is designed for a hand-held wafer grinder
• Check if the product qualifies for duty-free treatment under a trade agreement by confirming its origin