Hydraulic Wafer Lapping Tool from United States
A handheld hydraulic tool for lapping semiconductor wafers to achieve ultra-flat surfaces before fabrication. It is classified under tariff item 8467.89.00 as a hydraulic hand tool.
Duty Rate — United States → Canada
25%
Rate breakdown
26SUR2525%United States Surtax Order (2026) — 25% on US products
Import Tips
• Verify the tool is not a machine tool for working metal; if it is, it may be classified under headings 8456-8466
• Ensure it is not solely for semiconductor manufacturing, which could lead to classification under 8486