Hydraulic Hand Wafer Grinder from Japan
A portable hydraulic grinder for initial wafer thickness reduction after slicing. It is a handheld tool with hydraulic power, classified under tariff item 8467.89.00.
Duty Rate — Japan → Canada
0%
Import Tips
• Confirm the grinder is not a machine tool for working metal; if it is, it may be classified under headings 8456-8466
• Ensure it is not solely for semiconductor manufacturing, which could lead to classification under 8486