Wafer Slicing Diamond Wire Guide Roller from United States
A diamond-impregnated guide roller for inner-diameter wafer slicing saws of heading 84.65, maintaining tension and alignment of diamond wire during high-precision cuts from silicon boules. This roller is essential for producing thin, damage-free wafers. It is classified under tariff item 8466.92.00.
Duty Rate — United States → Canada
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Import Tips
• Declare the guide roller as a part of a wafer slicing saw and provide specifications showing its diamond-impregnated construction
• Ensure it is not classified as a tool of heading 82.07, as it is a machine part