Wafer Slicing Coolant Nozzle Assembly from Japan
A precision coolant nozzle manifold for wafer slicing saws of heading 84.65, delivering deionized water to the diamond wire cut zone to prevent thermal damage to silicon wafers. The adjustable flow is designed for 200-450mm wafers. This accessory is classified under tariff item 8466.92.00.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the nozzle assembly as an accessory of a wafer slicing saw and ensure it is not classified as a general nozzle under heading 84.24
• Provide documentation showing its specific design for wafer slicing saws