Wafer Polishing Head Assembly from Japan
A kinematic polishing head with retaining ring for wafer polishers of heading 84.65, applying controlled pressure and slurry distribution for mirror-finish semiconductor wafer surfaces. This head is essential for final wafer preparation before further processing. It is classified under tariff item 8466.92.00.
Duty Rate — Japan → Canada
0%
Import Tips
• Declare the polishing head as a part of a wafer polishing machine and provide details of its kinematic design to support classification
• If the head is imported with the polisher, the complete machine may be classified under heading 84.86