Wafer Lapping Plate from United States
A cast iron or ceramic lapping plate used in double-sided wafer lappers to achieve total thickness variation (TTV) of less than 1 μm on silicon wafers. It provides a precise flat reference surface for loose abrasive slurry processing, essential for semiconductor wafer preparation. This plate is a part or accessory suitable for machines of heading 84.65, which includes wafer lapping equipment.
Duty Rate — United States → Canada
0%
Import Tips
• Ensure the lapping plate is declared as a part of a machine of heading 84.65, not as a standalone tool, to benefit from the correct duty rate
• Keep documentation showing the principal use with wafer lapping equipment to support classification
• Verify whether the plate qualifies for preferential tariff treatment under a free trade agreement