Wafer Lapper Slurry Distribution Ring from Japan
A perforated slurry distribution ring for wafer lappers of heading 84.65, ensuring uniform abrasive delivery across the platen surface for consistent material removal rates. Made of semiconductor-grade polymer, this part is essential for precision lapping. It is classified under tariff item 8466.92.00.
Duty Rate — Japan → Canada
0%
Import Tips
• Classify the distribution ring as a part of a wafer lapper and be ready to specify the machine model it is designed for
• If the ring is made of polymer, ensure it is not classified as a general plastic article under Chapter 39