Wafer Crystal Grinder Diamond Wheel from China
A resin- or metal-bonded diamond grinding wheel for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing. It achieves flatness specifications critical for wafer uniformity, a function of machines of heading 8465.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the grinding wheel is classified as a part for crystal grinders of heading 8465; provide technical specifications to support the classification
• Check if the product qualifies for duty-free entry under the ITA for semiconductor manufacturing equipment
• Provide a letter of explanation to CBSA if the product's use is questioned