Semiconductor Wafer Slicing Diamond Saw Blade from China
An ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers. It features coolant channels and precise kerf for minimal material loss, a key tool for machines of heading 8465.
Duty Rate — China → Canada
0%
Import Tips
• Classify the saw blade as a tool holder or part for wafer slicing saws of heading 8465; provide a detailed product description to CBSA
• Verify if the product qualifies for duty-free treatment under the ITA for semiconductor manufacturing equipment
• Keep records of the machine it is designed for to avoid misclassification