Semiconductor Wafer Lapping Plate from United States
A cast iron lapping plate used in wafer grinders and lappers of heading 84.65, providing a flat reference surface for bringing silicon wafers to critical thickness tolerances before polishing. Designed for loose abrasive slurry processes, this plate ensures uniform material removal. It falls under tariff item 8466.92.00 as a part or accessory for machines of heading 84.65.
Duty Rate — United States → Canada
0%
Import Tips
• Declare the lapping plate as a part of a wafer lapping machine and be ready to specify the machine model it is designed for
• If the plate is made of cast iron, ensure it is not classified as a general article of base metal under Section XV