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CMP Polishing Head for Semiconductor Wafers

A chemical mechanical planarization (CMP) polishing head with retaining ring and retaining ring extension for wafer polishers. It applies slurry and pressure for global planarization before device fabrication, a key process in semiconductor manufacturing performed by machines of heading 8465.

Import Duty Rates by Country of Origin

Origin CountryMFN TariffSurtaxesTotal Effective Rate
πŸ‡¨πŸ‡³ChinaFreeβ€”Free
πŸ‡²πŸ‡½MexicoFreeβ€”Free
πŸ‡ΊπŸ‡ΈUnited StatesFreeβ€”Free
πŸ‡©πŸ‡ͺGermanyFreeβ€”Free
πŸ‡―πŸ‡΅JapanFreeβ€”Free

More Specific Codes

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Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8466.91.00Same rate: Free

If the polishing head is for machines of headings 8464

Parts for stone or ceramic working machines are classified under a different item.

Not sure which classification is right?

The Tariff Assistant works through the GRI rules on your specific product to reach the right tariff item β€” and can price the duty on it in the same conversation.

Import Tips & Compliance

β€’ Ensure the polishing head is classified as a part for wafer polishers of heading 8465; provide a detailed product description to CBSA

β€’ Check if the product qualifies for duty-free entry under the ITA for semiconductor manufacturing equipment

β€’ Keep records of the machine it is designed for to avoid misclassification

Related Products under Tariff item 8466.92.00

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An automated diamond dresser for crystal boule flat grinders, conditioning the grinding wheel to precise angles indicating crystal orientation. It is critical for semiconductor industry standards. This dresser is an accessory for machines of heading 84.65, specifically crystal grinders.

Cast Iron Bed Frame for Wafer Grinder

A rough cast iron bed frame for wafer grinding machines, processed only by cleaning and minimal machining to eliminate casting defects and enable finishing machine alignment. It is essential for maintaining the structural integrity and precision of the grinding machine, which falls under heading 8465 as machinery for working semiconductor materials.

Cast Iron Column for Wafer Slicing Saw

A rough-machined cast iron vertical column for wafer slicing saws, cleaned of sprues and fins with locator machining only. It supports precise blade movement for slicing semiconductor boules into wafers, a key function of machines under heading 8465.

Cast Iron Foot Bracket for Crystal Grinder

A semi-finished cast iron foot bracket for crystal grinders in wafer preparation equipment, with risers removed and locator faces machined. It ensures machine stability during boule diameter grinding, a process performed by machines of heading 8465.

Cast Iron Headstock Casting for Lapper Machine

A basic cleaned and de-finned cast iron headstock for wafer lapping machines, machined solely for finishing alignment. It is critical for surface flatness in semiconductor wafer preparation, a function of machines under heading 8465.

Cast Iron Machine Base for CNC Lathe

A rough-machined cast iron base designed for mounting CNC lathes of heading 8465, cleaned and machined only to remove casting fins, gates, sprues, and risers for precise location in finishing machinery. This part provides a stable foundation for the lathe's operation.