Diamond Grinding Wheel Arbor for Wafer Polishers from Japan
This specialized arbor holds diamond-impregnated grinding wheels for semiconductor wafer polishers, achieving nanometer-level flatness. It is a part suitable solely for grinding machines of heading 84.64, which include machines for polishing hard materials. Therefore, it is classified under tariff item 8466.91.00 as a part for those machines.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the arbor is not classified as a tool holder, which would fall under a different subheading (8466.10)
• Provide specifications showing the arbor is solely for heading 84.64 polishers
• Verify if the arbor's material (e.g
• steel) triggers any additional import requirements