Wafer Slicing Diamond Saw from Germany
A high-precision inner-diameter saw with a diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. It is classified under tariff item 8466.30.00 as a special attachment dedicated to semiconductor wafer manufacturing.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the saw is presented as an attachment for machines of headings 84.56 to 84.65, not as a standalone machine
• Provide technical specifications showing its specialized function for semiconductor boules
• Check for any applicable trade agreement benefits