Semiconductor Wafer Polisher Dividing Head from China
A rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. It is a special attachment for polishing machines of heading 84.64, which covers equipment for working stone, ceramics, and similar materials, and is classified under tariff item 8466.30.00.
Duty Rate — China → Canada
0%
Import Tips
• Ensure the dividing head is not a standard part of the polisher; if it is, it may be classified with the machine under heading 84.86
• Provide a detailed description and technical drawings to CBSA to support classification as a special attachment
• Consider whether the item is eligible for duty-free entry under the Information Technology Agreement