Semiconductor Wafer Lapper from United States
A machine that laps both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness for subsequent processing. As a special attachment for wafer prep machines, it falls under tariff item 8466.30.00.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm that the lapper is solely or principally used with machines of headings 84.56 to 84.65
• Provide a detailed description of its function to the CBSA
• Verify if the item qualifies for duty-free entry under a trade agreement