Double-Side Semiconductor Wafer Grinder from Japan
A simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. It is a special attachment for wafer preparation equipment, classified under tariff item 8466.30.00.
Duty Rate — Japan → Canada
0%
Import Tips
• Ensure the grinder is presented as an attachment for machines of headings 84.56 to 84.65, not as a standalone machine
• Provide technical specifications to support classification
• Check for eligibility under Canada's tariff preference programs