Wafer Slicing Saw from United States
A precision saw designed to slice thin wafers from monocrystalline semiconductor boules, such as silicon crystals produced by the Czochralski method. It is classified under this tariff item as a slicing machine for hard materials like silicon.
Duty Rate — United States → Canada
PGA flags (2)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be requiredHCConsumer Products SafetyMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090. Logic: MATCH IF (Valid HS Code).
- HC
Consumer Products Safety · May be required · on some HTS numbers under this code
May require HC Consumer Products Safety depending on intended use (HC21) and Canadian product category (HC29, HC30, HC31, HC32, HC33, HC34, HC35, HC36, HC37); or intended use (HC22, HC23, HC24, HC26, HC27) and Canadian product category (HC37), and on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090; Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090. Logic: MATCH IF (Valid HS Code) AND (Intended Use Code) AND (Valid Canadian Product Category).
CBSA Single Window matching criteria, unknown
Import Tips
• Confirm the saw's primary function is slicing, not polishing or grinding
• Provide the CBSA with technical documentation to support classification
• Verify if the machine is eligible for duty relief under trade agreements