Single-Side Wafer Lapping Machine from Germany
A single-side wafer lapping machine that laps semiconductor wafers to precise thickness and flatness tolerances using abrasive slurries. This machine prepares the front surface of wafers for fabrication, ensuring uniformity and surface quality.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the machine is classified as a machine-tool for working hard materials, not as semiconductor manufacturing equipment under heading 84.86
• Provide CBSA with the machine's specifications and the abrasive materials used
• Consider whether the machine qualifies for duty reduction under a trade agreement