Silicon Ingot Slicer from United States
An automated slicer for cutting silicon ingots into wafers suitable for integrated circuit production, featuring wire saw technology. It falls under this tariff item as a slicing machine for hard semiconductor materials, similar to hard plastics or hard rubber.
Duty Rate — United States → Canada
PGA flags (2)Show detailsHide detailsECCCVehicles and Engine Emissions ProgramMay be requiredHCConsumer Products SafetyMay be required
- ECCC
Vehicles and Engine Emissions Program · May be required · on some HTS numbers under this code
May require ECCC Vehicles and Engine Emissions Program depending on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090. Logic: MATCH IF (Valid HS Code).
- HC
Consumer Products Safety · May be required · on some HTS numbers under this code
May require HC Consumer Products Safety depending on intended use (HC21) and Canadian product category (HC29, HC30, HC31, HC32, HC33, HC34, HC35, HC36, HC37); or intended use (HC22, HC23, HC24, HC26, HC27) and Canadian product category (HC37), and on the full 10-digit classification number (only some numbers under this code are listed). Matching criteria: Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090; Equal To 8465960011; Equal To 8465960012; Equal To 8465960019; Equal To 8465960090. Logic: MATCH IF (Valid HS Code) AND (Intended Use Code) AND (Valid Canadian Product Category).
CBSA Single Window matching criteria, unknown
Import Tips
• Ensure the slicer is designed for slicing, not for other processes like grinding
• Document the machine's specifications for CBSA classification
• Check if the machine qualifies for duty-free treatment under the Information Technology Agreement