Precision Wafer Back Grinder from Germany
A precision wafer back grinder that reduces the thickness of semiconductor wafers from 775 micrometres to 50-100 micrometres for 3D IC stacking. This machine prepares thin wafers for advanced semiconductor packaging applications.
Duty Rate — Germany → Canada
0%
Import Tips
• Ensure the grinder is classified correctly as a machine-tool for working hard materials, not as semiconductor manufacturing equipment under heading 84.86
• Provide CBSA with the machine's specifications and intended use
• Check if the machine qualifies for reduced duty under a trade agreement by submitting the appropriate documentation