Double-Side Wafer Grinder/Polisher from Mexico
A double-side wafer grinder/polisher that processes both faces of semiconductor wafers simultaneously to achieve parallelism and precise thickness control. This machine is essential in semiconductor wafer preparation, ensuring the substrate meets strict flatness and surface quality requirements before fabrication.
Duty Rate — Mexico → Canada
0%
Import Tips
• Ensure the machine is classified as a machine-tool for working hard materials, not semiconductor manufacturing equipment under heading 84.86
• Have technical documentation ready to demonstrate its function for CBSA officers
• Verify if the machine qualifies for duty-free treatment under a free trade agreement by providing a valid certificate of origin