Diamond Wire Wafer Slicing Saw for Silicon Boules from United States
A diamond wire wafer slicing saw is a high-precision machine that slices ultra-thin wafers from monocrystalline silicon boules with minimal kerf loss. It is classified under tariff item 8465.96.00 as a slicing machine for hard materials, including semiconductor materials.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm the machine's classification as a machine-tool for slicing hard materials
• Ensure compliance with Canadian safety standards for high-precision equipment
• Keep records of the machine's specifications for CBSA