Diamond Wire Wafer Slicing Saw for Silicon Boules from China
A diamond wire wafer slicing saw is a high-precision machine that slices ultra-thin wafers from monocrystalline silicon boules with minimal kerf loss. It is classified under tariff item 8465.96.00 as a slicing machine for hard materials, including semiconductor materials.
Duty Rate — China → Canada
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Import Tips
• Confirm the machine's classification as a machine-tool for slicing hard materials
• Ensure compliance with Canadian safety standards for high-precision equipment
• Keep records of the machine's specifications for CBSA