Diamond Wire Wafer Slicer from United States
A multi-wire diamond saw that uses fixed abrasive technology to slice multiple wafers from silicon boules simultaneously. This slicing machine is designed for hard semiconductor materials, which are similar to hard plastics or hard rubber, and thus falls under this tariff item.
Duty Rate — United States → Canada
0%
Import Tips
• Confirm the machine's principal function is slicing, not grinding or polishing, to ensure classification under this item
• Keep records of the machine's specifications for CBSA verification
• Check if the machine is eligible for duty-free treatment under the Information Technology Agreement